Bonding Applications
Inspect bond joints in composite structures
The challenges of industrial bonding
New and promising developments in bonding processes are making it possible to design more advanced composite structures. Specific defects from manufacturing such as porosity, contamination, lack of glue, or from service such as bond failure and cohesion failure are a challenge to non destructive testing methods. Luckily, with TPAC, multiple ultrasound techniques can be considered, such as pitch-catch, through transmission, pulse echo, phased array, FMC/TFM, PWI (Plane Wave Imaging) and many more.
TPAC offers wide frequency bandwidth solutions to address a variety of failure type detection in bonding joints of composite structure.
